Application Briefs

Blanket Silicon Etch

Blanket Silicon Etch

Compared to wet chemical approaches, dry blanket Si etching exhibits better control over the etch rate and uniformity.

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FOWLP - PVD Processes

FOWLP - PVD Processes

Fan-Out wafer-level packaging (FOWLP) technology provides higher integration levels and a greater number of external contacts.

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High Productivity UBM-RDL

High Productivity UBM-RDL

PVD solutions to deposit Under Bump Metallization (UBM) layers to enable bump metals to adhere to die electrical pad contacts, or to act as seeds for Cu plated Re-Distribution Layers (RDL).

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Plasma Dicing

Plasma Dicing

Stronger die - more die. High yield plasma dicing solutions based on industry leading Deep Reactive Ion Etch (DRIE) technology for dice-before-grind and dice-after-grind.

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Plasma Etch  End-point Control

Plasma Etch End-point Control

End-point detection (EPD) is essential for many wafer etch applications to ensure processes are carefully controlled and consistent.

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Via Reveal Processing

Via Reveal Processing

High productivity plasma etch processes with unique end-point detection used for post-TSV steps, to prepare the die for connection to other parts of the device.

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Etch and Deposition Processes for BioMEMS Manufacturing

Etch and Deposition Processes for BioMEMS Manufacturing

BioMEMS is an exciting area of the MEMS market, and SPTS offers a range of wafer processes which enable development and commercial manufacturing of BioMEMS

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AlN PVD for RF-IC & MEMS

AlN PVD for RF-IC & MEMS

Piezoelectric properties of AlN to convert mechanical strain into an electric signal, or vice versa is being exploited in devices such as RF filters and a growing number of MEMS.

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Low Temp CVD for MEMS

Low Temp CVD for MEMS

Low temp Plasma Enhanced Chemical Vapor Deposition (PECVD) solutions for depositing uniform and stable SiN and SiO films for MEMS devices at temperatures <200°C.

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MEMS Microphones

MEMS Microphones

MEMS microphones have been growing rapidly in recent years for a variety of applications, primarily mobile devices, but also other products such as hearing aids, Bluetooth headsets, and “digital assistants”.

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MVD for MEMS

MVD for MEMS

Molecular Vapor Deposition (MVD®) is a unique process technology that deposits ultra-thin films by vapor deposition at low temperatures on a broad spectrum of substrates.

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WL Packaging of MEMS

WL Packaging of MEMS

Wafer level packaging (WLP) prior to wafer dicing of MEMS devices can provide protection from particles and dicing slurry, while significantly reducing form factor and reducing the overall die cost.

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Intro to HF Release Etch

Intro to HF Release Etch

HF etching is a dry vapour (plasma-less) etch process to remove sacrificial oxide layers, primarily used to release silicon MEMS structures.

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XeF2 for MEMS Release

XeF2 for MEMS Release

XeF2 vapour etching is a highly selective isotropic etch for removing sacrificial layers of Si, Mo or Ge to release MEMS miccrostructures.

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SiC Etch for Power & RF Devices

SiC Etch for Power & RF Devices

SiC is a wide bandgap material used in power applications and GaN-on-SiC RF devices. It is very difficult to etch but SPTS' Synapse etch system can provide etch rates 2-4x faster than conventional ICP etching.

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Plasma Processes for VCSELs

Plasma Processes for VCSELs

New applications for VCSELs include proximity sensing for automotives and gesture/face recognition for consumer products and SPTS offers a range of processes for VCSEL manufacturing including ICP etch, PVD, and PECVD.

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Additive Printing Solution Dams

Additive Printing Solution Dams

Orbotech's Magna inkjet technology can be used to print 3D structures such as underfill dams onto PCB substrates.

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Inkjet - Package Marking

Inkjet - Package Marking

Orbotech's Jetext inkjet technology can be used for high contrast, no-contact package marking, with no risk of heat damage that can occur with laser engraving, particularly with increasingly thinner die.

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SPT Microtechnologies (Thermal Products) Application Briefs

Thick Poly-Si for MEMS

Thick Poly-Si for MEMS

SPT’s Advanced Vertical Processor (AVP) has been designed to deposit doped and un-doped polysilicon films >4μm thick without wafer sticking

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LPCVD SiN for MEMS

LPCVD SiN for MEMS

SPT's LPCVD SiN process that combines the excellent stress control and process repeatability of a PECVD process together with the benefits of low wet etch rate and low ownership cost of an LPCVD system

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H2 Annealing for MEMS

H2 Annealing for MEMS

Surface transformation to remove the "scallops", created by silicon DRIE during MEMS manufacturing, can be achieved by annealing the Si wafers at high temperature (~1100°C) in a H2 ambient in SPT's RVP furnace.

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Case Studies

University of Swansea - "Plasma Etch for Silicon Microneedles"

University of Swansea - "Plasma Etch for Silicon Microneedles"

Illustrates the results of a joint development project between SPTS and University of Swansea to create a process for volume production of silicon microneedles for biomedical applications.

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imec - "Blanket Silicon Etch for Lower Cost TSV"

imec - "Blanket Silicon Etch for Lower Cost TSV"

Discusses the introduction of blanket silicon etching to replace CMP, as part of a joint development project with imec to optimize a manufacturable "TSV-last" route for a multi-wafer stack.

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Skyworks - "Improving MTBC for SiN Etch"

Skyworks - "Improving MTBC for SiN Etch"

Describes how SPTS worked with Skyworks to significantly improve Mean Time Before Clean (MTBC) for a SiN etch step, used in the manufacturing of their GaAs RF devices.

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Qorvo - "Successful Partnering for a Rapid Ramp"

Qorvo - "Successful Partnering for a Rapid Ramp"

Describes how SPTS worked with Qorvo to enable them to successfully install and qualify multiple tools to satisfy the need for a rapid ramp in production.

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