XeF2 釋放式蝕刻

 
Xactix® XeF2 釋放式蝕刻系統
使用二氟化氙对矽進行等向性蝕刻是釋放 MEMS 裝置的理想解決方案。XeF2 展現了幾乎所有標準半導體材料 (光阻層、二氧化矽、氮化矽及鋁) 對於矽的高選擇比。XeF2 作為氣相蝕刻劑,可以避免通常與濕式或電漿蝕刻制程相關聯的許多問題。 
 

SPTS 提供下列 Xactix® 二氟化氙蝕刻系統:
Xactix® e2

Xactix® e2

The Xactix® e2 is an ideal solution for those seeking a low cost, table-top R&D xenon difluoride etching system. Key to successful research is...

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Xactix® X4 Series™

Xactix® X4 Series™

The accelerated etch rates and superior components make the Xactix® X4 ideal for intensive R&D and pilot production. It is the leading XeF2 etch...

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Xactix® CVE

Xactix® CVE

The CVE module is compatible with SPTS' cluster platforms, and has a unique chamber design which provides high etch rates, uniformity and efficiency....

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