XeF2 釋放式蝕刻

 
Xactix® XeF2 釋放式蝕刻系統
使用二氟化氙对矽進行等向性蝕刻是釋放 MEMS 裝置的理想解決方案。XeF2 展現了幾乎所有標準半導體材料 (光阻層、二氧化矽、氮化矽及鋁) 對於矽的高選擇比。XeF2 作為氣相蝕刻劑,可以避免通常與濕式或電漿蝕刻制程相關聯的許多問題。 
 

SPTS 提供下列 Xactix® 二氟化氙蝕刻系統:
Xactix® e2

Xactix® e2

Key to successful research is process flexibility and...

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Xactix® X4 Series™

Xactix® X4 Series™

The Xactix® X4 Series™ is the leading XeF2 etch system for releasing MEMS devices. Its...

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Xactix® CVE

Xactix® CVE

The CVE module has a unique chamber design which provides high etch rates, uniformity and efficiency. It is designed to fit...

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