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Orbotech is proud to be a KLA company
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For over 30 years, Orbotech's innovative micro-manufacturing technologies have assisted in the creation of life changing electronic devices.
Be a part of our future.
- 公司概述
- PCB
- FPD
- SPTS
- SOLUTIONS & TECHNOLOGIES
- Applications
- About SPTS
- About SPTS
- Corporate Responsibility
- Awards
- SPTS Careers
- SPTS Contacts
- Resource Library
- Tech Insights
- MEMS
- 1000th DRIE module installed
- AlN and its Uses in the Electronics Industry (Part I)
- Claritas End-point for DRIE
- Cost-Effective Low Stress SiN for MEMS
- Etch and Deposition Processes for BioMEMS Manufacturing
- Introduction to HF Vapor Etch
- Low Temperature PECVD for MEMS
- MEMS for Mobile Applications
- MEMS Microphones
- Morflex – Flexible Process Control for MEMS & TSV
- MVD Anti-stiction Coating for MEMS
- Plasma Dicing (Dice Before Grind)
- Plasma Dicing (Dice After Grind)
- Plasma Etch End-Point Control
- Plasma Processes for VCSELs
- Surface Smoothing Processes for High Performance AlN Piezoelectrics
- Wafer Level Packaging of MEMS
- Xenon Difluoride - Dry Vapor Etch for Releasing MEMS
- Advanced Packaging
- Power Device Manufacturing
- RF-IC
- MEMS
- Technology Papers
- Presentations
- R&D Projects
- Case Studies
- Literature Library
- Tech Insights
- 新闻与活动
- 招贤纳士
- 联系人
