Sep 25, 2018

聚焦奥宝科技PCB事业部新任总裁Yair Alcobi


Sep 18, 2018

让制造更智能化: AI 和印刷电路板世界

作者:奥宝科技算法团队经理 Dima Pundik


2018 年 6 月 21 日

高频率 5G 无线网络架构需要新的 PCB 制造方式

作者:Benny Solomon, AOI and AOS Marketing Director, Orbotech


May 09, 2018


ECN Brainstorm featuring: Benny Solomon, AOI and AOS Marketing Director, Orbotech


April 30, 2018

Creating Perfect Solutions as Basic Principle of Business

Published by NanoIndustry Magazine - an interview with SPTS's Franck Torres-Miguel, Regional Account Manager. 

Read more

April 09, 2018

From math to marketing: Orbotech CMO’s worldview of the industry?

Interview with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan

Read more



作者:Micha Perlman



从幕后到台前:聚焦 AOS - AOI及AOS产品副总裁Eran Lazar访谈.




作者:Ron Kupershtein


October 23, 2017

mSAP: The New PCB Manufacturing Imperative for 5G Smartphones.

Published by: Electronic Design , Writer: Meny Gantz

Read More

October 15, 2017

Flexible OLED displays drive market disruption, manufacturing innovation.

Published by: Evaluation Engineering , Writer: Shulik Leshem & Noam Cohen

Read More

August 28, 2017

Foxconn Gen 10+ LCD Display Manufacturing Highlights Yield Management Challenges with Large-Screen TVs.

Published by: EBN , Writer: Shulik Leshem

Read More

August 09, 2017

Autonomous Vehicles: Driving Innovation In PCB Manufacturing.

Published by: ECN , Writer: Shavi Spinzi

Read More

July 17, 2017

Miniaturized PCBs at the Intersection of Form and Function.

Published by: , Writer: Gil Tidhar

Read More

July 01, 2017

The Evolution of Industry 4.0, Through the Eyes of the PCB Manufacturer.

Published by: Evaluation Engineering , Writer: Shavi Spinzi

Read More

July 05, 2017

Q&A with David Butler EVP and General Manager of SPTS Technologies Ltd., about his vision of the market and company’s solutions.

Published by: i-Micronews

Read More

April 25, 2017

The Struggle to Shrink System Size: Innovative Technologies Driving the Next Generation of Mobile Devices.

Published By: Global SMT & Packaging , Writer: Hanoch Kopel

Read More

March 27, 2017

Plasma Dicing: Strength in Numbers

Published by: Silicon Semiconductor, Writer: Richard Barnett

Read More

March 23, 2017

The Near and Far Future for Orbotech and Inspection

Published by: I-Connect007 , Interview with Arik Gordon, President, PCB, Orbotech

Read More

March 01, 2017

Flex circuits: Innovations and processes

Published by: EDN , Writer: Micha Perlman

Read More

January 12, 2017

Flexible OLED Displays: Overcoming the Final Barriers to Mass Commercialization with High-Yield Manufacturing Processes

Published by: EBN , Writer: Shulik Leshem

Read More

December 15,  2016

Q&A with Richard Barnett about SPTS's Plasma Dicing solutions, position in the industry and vision of the market

Published by: i-Micronews

Read More

September 10,  2016

"Plasma Dicing - Benefits and Process Considerations"

Published by: TAP Times, Writer: Richard Barnett

Read More

August 17, 2016

"Fan-Out Wafer Level Packaging - breakthrough advantages and surmountable challenges"

Published by: Solid State Technology, Writer: David Butler

Read More

June 14, 2016

"Comparison between wet and dry silicon via reveal in 3D backside processing"

Published by: Chip Scale Review, Writer: Dave Thomas et al. (SPTS), Anne Jourdain et al. (imec)

Read More

May 16, 2016

"Advances in Back-Side etching of SiC for GaN"

Published by: Solid State Technology, Writer: Anthony Barker

Read More

April 18, 2016

Q&A with David Butler concerning the latest Advanced Packaging trends

Published by: i-Micronews, Writer: David Butler

Read More

April 29, 2016

Fan-Out Wafer Level Packaging platform discussed with SPTS Technologies

Published by: i-Micronews , Writer: David Butler

Read More

Cautionary Statement Regarding Forward-Looking Statements 

Except for historical information, the matters discussed in this website (including in press releases, webcasts, presentations, posts and other places) are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events as of the date of the applicable information (press releases, webcasts, presentations, or posts) and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as “Brexit”) and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.

The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. This information is also supplemented by the information in the applicable document on this website (e.g., press release, webcast, presentation,  posts and other document). The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this website (including press releases, webcasts, presentations,  posts and other places) to reflect new information, future events or otherwise, except as required by law.