2018年3月19日

从幕后到台前:聚焦 AOS -

AOI及AOS产品副总裁Eran Lazar访谈

 

请您先做一个简单的自我介绍

我是 Eran Lazar,2015年开始担任奥宝科技AOI与AOS产品副总裁。 在我们推出Discovery之前,也就是2005年,我便开始担任应用程序工程师,如今在奥宝科技PCB事业部任职已经超过13年了。 自此之后,我在AOI产品和PCB事业部先后担任过许多职务。 今天,我很荣幸能领导这支非常了不起的团队,与他们一起负责AOI及AOS领域中最出色、最创新的解决方案。

个人生活方面,与妻子 Yael结婚,有三个女儿

AOS有哪些特别之处?

我们研发自动光学成形 也就是 AOS的历程代表了奥宝科技一直以来的发展理念。 奥宝科技致力于技术方面的大力投资,特别是有利于产业发展的技术,即使无法迅速获得投资回报(ROI)。 在过去12,13年间,我们投资于全新的成形及3D成形技术,因为我们预见了PCB产业的发展趋势。 我们了解在某个时刻,业界会往前进,使用肉眼无法看见的更加精细的线宽/ 间距的高密度 PCB。为了维持良率,客户可能被迫放弃简单的人工修复解决方案,而改用可以同时进行烧蚀以及加铜的自动成形解决方案, 用来保证线路的形状能忠于原始的 CAM设计。

2016年,类载板/mSAP成为先进智能型手机生产的标准,这样的需求随之增加。由于高阶PCB的线宽/间距更加密集,并从50µm降至30µm,业界已经将AOS视为改善良率唯一可行的方法。

没有任何产品 能 和奥宝科技的 AOS,尤其是Precise ™ 800相媲美 。 奥宝科技的AOS采用了我们过去10几年研发的独特技术,而这也催生出质量和性能都堪称先进的创新解决方案。 即使面临极具挑战的情况,客户也能获得所需的良率。 在产品发布将近2年后的今天,Precise 800及Ultra Perfix 120S都已经成为生产制程的关键要素。 由于其对良率的直接及显著的影响,也成为了新产品研发制程中的一部分。

Precise获得了哪些认可?

Precise广获客户认可,而且也备受一些主要终端客户 (电子产品设计师) 的赞赏。它也顺利通过独立协会(包含IPC)的严格审查程序,这点尤其重要。 奥宝科技的Precise是唯一一款顺利通过如此严苛测试的产品。我们致力于与业界合作,确保我们的解决方案可持续引领潮流并为客户提供最佳的性能。

您对未来发展趋势有何预测?

越来越精细、密集的线条以及在相同甚至更小的间距内放入更多数据和更多功能,是行业的大势所趋。现在比过去更清楚的一点是,在高阶HDI、汽车、软板和IC载板等基材可接受的损害低至 1.5µm的高端市场中,手动修复将于未来几年完全消失,而AOS 将扮演关键角色,带来量产所需的良率。 简言之,如果没有AOS,制造业可能不会具有成本效益或可行性。在所有高端市场中,AOS已经成为一款真正的量产工具。

即使在先进封装及拥有嵌入式芯片的嵌入式裸晶等更先进的应用中, AOS也将成为制造程序中的一部分。 那些应用很复杂且成本颇高。 由于芯片最为重要且功能都围绕芯片加以设计,因此修复的投资报酬率更大。 芯片的成本可能超过10美元,所以在生产制程当中产生报废会对成本造成重大影响。 这是客户决定即刻将AOS纳入目前研发制程之生产工具时的重要因素。 在此阶段将AOS列入考虑并仰赖它提升良率,量产目标才可实现。

我相信在未来 2到4年内,AOS市场的发展会随着线宽/间距密度提升这一大趋势而更加蓬勃,而每个客户拥有的AOS 解决方案平均数量也会大幅增加。

您最近面临的主要挑战之一是什么?

我面临的主要挑战,同时也是业内最重大的挑战,就是如何改造 AOI等成熟稳定市场中的产品,以及为客户提供真正的附加价值。 2017年,我们推出了Ultra Dimension®,它的发布使市场和客户的态度发生了实质性转变,改变了AOI的作业流程,大幅降低了整体拥有成本 (TCO) 。

目前, Ultra Dimension®解决方案已经在多个量产现场安装并成功运行。不到半年的时间内,我们售出了数十套Ultra Dimension®解决方案,而客户们对此产品的关切程度也持续提升。 我们还推出了全新的AOI作业流程,可以直接连接AOI及AOS并应用于工业4.0 , 这一概念使我们获得了更大的成果。

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