Orbotech in the media
The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by manufacturing processes that have evolved from manual assembly to highly automated production. As manufacturing technology further develops, processes become more complex and more sophisticated, including the ability to inspect and then shape defects that would once have resulted in scrapped panels. A significant opportunity is now emerging for the PCB manufacturing industry to capitalize on artificial intelligence (AI) and optimize production processes and, ultimately, the entire PCB manufacturing facility. Read more from Meny Gantz, VP of Marketing in Orbotech’s Printed Circuit Board (PCB) division.