Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market

Newport, United Kingdom – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that a leading Chinese wafer level packaging (WLP)  supplier to the electronics industry has selected the Omega fxP Etch System for cost-effective through silicon via (TSV) processing of 300mm wafers for CMOS Image Sensor (CIS) applications.

"The global CMOS image sensor market continues to experience solid growth, driven by consumer demand for products such as mobile devices and autos," said Dave Thomas, etch marketing director at SPTS. “However, for customers to gain market leadership and remain competitive in a cost-sensitive industry, they must embrace new technologies, processes and wafer formats. Having achieved excellent throughput and high quality yields with our 200mm silicon etch tools, the customer chose our Omega fxP as their etch platform of choice in their move to 300mm.”

SPTS 300mm Omega fxP

The Omega fxP 300mm etch system has the flexibility to address multiple processes for advanced packaging applications including tapered via/ trench etching as well as blanket etching for stress relief post grinding and etch overhang control.  The system also incorporates in-situ endpoint for controlling wafer-to-wafer variability and improving yields.

Thomas concluded, “Our customers are taking a leading role in the migration to 300mm WLP, and we are very pleased to be supporting one of the first CIS suppliers in China to move to the larger wafer format.”

SPTS will be speaking about its range of etch, deposition and thermal processing solutions for advanced packaging applications at the upcoming 12th Annual Conference on China Semiconductor Packaging, Testing & Marketing, 4th – 6th June, 2014, Chongqing Int’l Exhibition Center, Chongqing, China. 

Company Contact: 
Destanie Clarke, 
Tel: +44 7951 203278,

Cautionary Statement Regarding Forward-Looking Statements 

Some of the matters discussed in this website (including in press releases, webcasts, presentations, posts and other places) are projections or other forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These statements are only predictions and actual events or results may differ materially. We refer you to the documents KLA files from time to time with the Securities and Exchange Commission, specifically, KLA’s most recent Form 10-K and Form 10-Q.  These documents contain important factors that could cause the actual results to differ materially from those contained in projections and other forward-looking statements including, among others, volatility and cyclicality in the semiconductor equipment industry and other industries in which KLA and its subsidiaries operate, potential fluctuations in operating results and stock price, international trade and economic conditions, the ability to compete successfully worldwide, management of technological change and customer requirements, fluctuations in product mix within and among divisions, the timing and strength of product and service offerings by KLA and its subsidiaries and its and their competitors, intellectual property obsolescence and infringement, and factors associated with key employees, key suppliers, acquisitions, and litigation. Additional factors impacting the business of KLA and its subsidiaries include integration between KLA and its acquired companies, ability to achieve synergies and other benefits of acquisitions in the timeframe anticipated, if at all,

KLA and its subsidiaries assume no obligation to update the information in this website (including press releases, webcasts, presentations, posts and other places) to reflect new information, future events or otherwise, except as required by law.


This site is provided by KLA Corporation (or its subsidiaries) on an "as is" basis. None of KLA and its subsidiaries make any representations or warranties of any kind, express or implied, as to the operation of the site, or the accuracy or completeness of the information, content, materials, pricing, services, or products included on this site. Product specifications and prices are subject to change without notice, and products may be discontinued without notice. None of KLA and its subsidiaries will be liable for any damages of any kind arising from the use of this site, or the material that is provided on this site, including but not limited to direct, indirect, special, incidental, punitive, or consequential damages.