Innovative, environmentally friendly inkjet processes transform the way solder mask is applied to PCBs for advanced electronics

YAVNE, ISRAEL, JULY 21, 2021Orbotech, a KLA (NASDAQ: KLAC) company, today announced that TTM Technologies, a global manufacturer of printed circuit boards and radio frequency components and assemblies, purchased and installed an Orbotech Neos™ 800, transforming the way solder mask is applied to PCBs. The recently available Orbotech Neos 800 inkjet solution replaces conventional solder mask (SM) processing with innovative additive SM printing. In this new installation, TTM cut the SM sequence by half compared to the existing conventional process, making it more efficient, reducing chemical waste and significantly cutting manufacturing turn-around time – an important capability in today’s fast-moving electronics industry.

TTM selected the Orbotech Neos 800 for its Stafford, Connecticut site following a rigorous testing and qualification program. TTM’s global PCB customers include leaders in aerospace, defense, automotive, computing and medical.

“We are very excited to have brought this groundbreaking, environmentally-friendly technology in-house,” said Phil Titterton, chief operating officer at TTM Technologies. “Additive printing of solder mask is a significant improvement for us, as it eliminates process steps compared to the way we typically apply solder mask. This high-speed solution is 100% additive with no mess, less power, fewer chemicals, and substantial material savings. The Orbotech Neos enables us to increase our productivity in a smaller footprint on the factory floor while providing high-quality products to our customers.” 

Currently available in the U.S. and Europe, the Orbotech Neos 800 combines several SM processing steps into a single multi-functional system, eliminating several manufacturing stages such as coating, tack-drying, exposure and developing. This streamlined, environmentally friendly, additive process increases productivity and ensures the consistent, high-quality printing that is critical to high volume manufacturing. It also enables reduced material and power consumption, as well as the associated labor and equipment maintenance costs, thereby decreasing the total cost of ownership.

“The Orbotech Neos 800 is another example of a disruptive technology coming to market from Orbotech, validating our innovative approach to manufacturing” said Yair Alcobi, president of the PCB division at Orbotech. “In the short time since it has been available, this technology has gained traction with customers. We’re hearing from them that as the demand for advanced PCBs rises, shorter time to market and increased productivity with less waste and energy are the main drivers in their decisions to bring the Orbotech Neos on board.”

At the core of the Orbotech Neos are two proprietary technologies: the new Structural Printing Technology™, enabling 3D-like quality printing, and the field-proven DotStream Pro Technology™, enabling precise solder mask printing at high speeds. Orbotech Neos can also print serialization data including 2D barcodes at multiple levels for advanced traceability capabilities.

For more information on the Orbotech Neos 800, please go to:

For the Orbotech Neos product video, please go to:


About Orbotech Ltd.:

Orbotech Ltd., a KLA company, is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs) and flat panel displays (FPDs), as well as software for PCB computer aided manufacturing (CAM), engineering and Industry 4.0. Orbotech's solutions are designed to enable the mass production of innovative, next-generation electronics and improve the cost effectiveness of existing and future electronics production processes. For more information, visit or

About KLA:

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at (KLAC-P).

About TTM

TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs and backplane assemblies as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at

Cautionary Statement Regarding Forward-Looking Statements 

Some of the materials contained on this website (including in press releases, webcasts, presentations, posts and other places) contain forward-looking statements and are subject to the Safe Harbor provisions created by the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments, business strategies and industry trends and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These statements are only predictions and actual events or results may differ materially. We refer you to the documents KLA Corporation (“KLA”) files from time to time with the Securities and Exchange Commission, specifically, KLA’s most recent Annual Report on Form 10-K and Quarterly Reports on Form 10-Q.  These documents contain important factors that could cause the actual results to differ materially from those contained in projections and other forward-looking statements including, among others, volatility and cyclicality in the semiconductor equipment industry and other industries in which KLA and its subsidiaries operate, potential fluctuations in operating results and stock price, international trade and economic conditions, the ability to compete successfully worldwide, management of technological change and customer requirements, fluctuations in product mix within and among divisions, the timing and strength of product and service offerings by KLA and its subsidiaries and its and their competitors, intellectual property obsolescence and infringement, and factors associated with key employees, key suppliers, acquisitions, and litigation. Additional factors impacting the business of KLA and its subsidiaries include integration between KLA and its acquired companies, ability to achieve synergies and other benefits of acquisitions in the timeframe anticipated, if at all.

KLA and its subsidiaries assume no obligation to update the information in this website (including press releases, webcasts, presentations, posts and other places) to reflect new information, future events or otherwise, except as required by law.


This site is provided by KLA (or its subsidiaries) on an "as is" basis. None of KLA and its subsidiaries make any representations or warranties of any kind, express or implied, as to the operation of the site, or the accuracy or completeness of the information, content, materials, pricing, services, or products included on this site. Product specifications and prices are subject to change without notice, and products may be discontinued without notice. None of KLA and its subsidiaries will be liable for any damages of any kind arising from the use of this site, or the material that is provided on this site, including but not limited to direct, indirect, special, incidental, punitive, or consequential damages.