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奥宝科技的 UV 激光钻孔系列让进阶紫外线钻孔性能达到了全新水平，可以满足目前最具挑战性的 IC 基板和封装应用的需要。这一独特的 UV 激光钻孔解决方案系列配备奥宝科技独创的 Multi-Path Technology™，可以实现第一流的高产能、高精度钻孔。
如需深入了解奥宝科技的 Emerald™ 160 系列，请单击下方产品图像。
Orbotech Apeiron™ provides best-in-class, high speed UV laser drilling for roll-to-roll (R2R) and sheet-by-sheet panel manufacturing of flexible...
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