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奥宝科技经过实测的各种 DI 系统经过精心设计,即使是最具挑战性的 FC-BGA、FC-CSP、BGA/CSP 及模块应用亦可轻松处理。 细线成像、高DI 产能以及卓越的对位精度,这三方面的突破可以提供无与伦比的成像质量。
系统配备奥宝科技享有专利的大镜面扫描技术(LSO Technology™),可以对精细至8µm 的极细线条进行成像。 对于FC-BGA/FC-CSP 生产,经过实测,系统不仅可以支持SAP和SAP程序的修改版本,同时还能确保间距低至20µm。 对于先进BGA/CSP 减材生产,我们的系统仍可提供每小时110 趟的超高产能。
业界领先的IC 载板制造商已经使用奥宝科技DI 系统以满足其对先进FC-BGA、FC-CSP、BGA/CSP 及模块生产的需求,以期获得更高良率,从而大幅降低底线成本,增加ROI。
| 线宽范围(µm) | |
| Paragon™-Ultra 300 | 8µm with 20µm pitch |
| Paragon™-Ultra 200X | 8µm with 20µm pitch |
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