XeF2 干法释放蚀刻

Xactix® XeF2 干法释放蚀刻系统

使用二氟化氙对硅进行等向性蚀刻是释放 MEMS器件的理想解决方案。在XeF2干法释放硅的过程中,XeF2对几乎所有的标准半导体材料(包括光刻胶、二氧化硅、氮化硅和铝)具有高选择性。作为气相蚀刻剂,XeF2 可避免与湿法或等离子蚀刻工艺相关的许多常见问题。

SPTS 提供以下 Xactix® 二氟化氙(XeF2)干法蚀刻系统:

Xactix® e2

Xactix® e2

The Xactix® e2 is an ideal solution for those seeking a low cost, table-top R&D xenon difluoride etching system. Key to successful research is...

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Xactix® X4 Series™

Xactix® X4 Series™

The accelerated etch rates and superior components make the Xactix® X4 ideal for intensive R&D and pilot production. It is the leading XeF2 etch...

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Xactix® CVE

Xactix® CVE

The CVE module is compatible with SPTS' cluster platforms, and has a unique chamber design which provides high etch rates, uniformity and efficiency....

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Inquiry about: XeF2 Vapor Release Etch

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