SPTS Products

Available on a range of wafer handling platforms, SPTS supplies semiconductor wafer processing systems for volume production, R&D or pilot production environments. Served markets include Advanced Packaging, MEMS, LEDs, Power Semiconductors, and High Speed RF-ICs.

Technologies and Process Solutions offered include:

Single Wafer Platforms

SPTS's ICP, DRIE, PECVD, PVD and MOCVD modules are available on 3 wafer handling platforms:

  • fxP® - 100 to 300mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
  • c2L® - 3" to 200mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
  • LPX - 3" to 200mm wafer size. Supports Etch & PECVD modules only

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Plasma Etch

Plasma Etch

Plasma etching involves RF-excitation of a selected gas mixture to create a plasma with the right reactive species to etch any un-masked areas on the wafer surface. The reactions...

等离子体切割

等离子体切割

作为使用机械划片或激光的传统分离方法的可行替代方案,采用深反应离子蚀刻 (DRIE)...

Mosaic™ System for Plasma Dicing
HF 释放蚀刻

HF 释放蚀刻

Primaxx® 蚀刻系统 从用于研发的实验室系统到用于大批量生产的多腔集群工具,SPTS 提供范围最广泛的干燥 HF...

XeF2 Vapor Release Etch

XeF2 Vapor Release Etch

Xactix® XeF2 干法释放蚀刻系统 使用二氟化氙对硅进行等向性蚀刻是释放...

Metal Deposition

Metal Deposition

Sigma® 金属沉积系统   Sigma 产品系列支持 100mm 至 300mm 的晶圆尺寸,沉积技术覆盖了传统 的PVD 到 MOCVD...

Sigma® deposition systems
Molecular Vapor Deposition  (MVD®)

Molecular Vapor Deposition (MVD®)

MVD® 用高度可重现的气相沉积方法取代了传统的液相包裹工艺,该新方法非常适合制造应用。 受益于 MVD®...

PECVD

PECVD

SPTS 的 Delta PECVD 系统可用于 MEMS、化合物半导体和先进封装中的广泛应用   o 晶圆尺寸支持从 75mm 至...

Delta® PECVD
Inkjet Package Marking

Inkjet Package Marking

Orbotech Inkjet™ 600 Orbotech Inkjet™ 600...

单片式晶圆处理平台

单片式晶圆处理平台

为满足批量生产、试生产和研发应用的需求,SPTS 在一系列可供选择的晶圆处理平台上提供多种蚀刻与沉积工艺技术:  

Thermal Products

Thermal Products

Under agreement with SPP Technologies Ltd (SPT), SPTS offers a range of large batch vertical furnaces (LPCVD), and APCVD systems.  We are able to offer both new and...