SPTS’ Etch and PECVD Process Solutions Key to Production of E-Beam Lenses for Maskless Lithography

Newport, United Kingdom – SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that Mapper Lithography has selected SPTS’ etch and low temperature chemical vapor deposition (CVD) systems on a Versalis fxP multi-technology platform for their new fab in Moscow. Mapper will use SPTS’ deep reactive ion etch (DRIE) module to create through silicon via holes with high dimensional accuracy, a critical and essential requirement in the production of electron beam (e-beam) lenses for their groundbreaking maskless lithography technology. Mapper also selected SPTS’ plasma enhanced CVD system (PECVD) because it allows for a lower deposition temperature than competing systems, enabling a novel integration scheme.

“Mapper’s e-beam lenses are based on high precision holes through silicon wafers,” stated Dave Thomas, SPTS’ marketing director for etch products. “The Rapier DRIE PM is uniquely able to provide the required high-level of profile control, selectivity and uniformity needed for these critical features. Furthermore, Rapier achieves this at productive etch rates, ensuring the highest yields and lowest cost of ownership possible for Mapper.”

“Our maskless lithography tools utilize an innovative multiple E-beam technology with which semiconductors can be manufactured in a more cost effective fashion,” stated Denis Shamiryan, Manufacturing Director at Mapper Lithography. “It makes the traditionally used mask redundant and combines high resolution with high productivity. SPTS’DRIE solutions deliver the etch rate, etch profile and positional accuracy during the silicon etching process which are vital to our approach.”

SPTS Technologies’ Versalis fxP multi-technology cluster platform offers many benefits, including lower cost of ownership and smaller footprint. By combining DRIE and CVD on the same platform, Mapper significantly reduced their capital outlay compared to buying traditionally configured single technology systems. Additionally, Mapper is benefiting from SPTS’ single chamber multi-process capability as the same CVD module can also be used to deposit multiple film types, including silicon oxide, silicon nitride and amorphous silicon with outstanding adhesion and particle performance. With critical elements of Mapper’s product sensitive to temperature, the ability to deposit high quality films at temperatures <150ºC made it a compelling solution for this application.


About SPTS Technologies

SPTS Technologies, an Orbotech (NASDAQ:ORBK) company, designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com


Company Contact:
Destanie Clarke, 
Tel: +44 7951 203278, 

Cautionary Statement Regarding Forward-Looking Statements 

Some of the materials contained on this website (including in press releases, webcasts, presentations, posts and other places) contain forward-looking statements and are subject to the Safe Harbor provisions created by the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments, business strategies and industry trends and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These statements are only predictions and actual events or results may differ materially. We refer you to the documents KLA Corporation (“KLA”) files from time to time with the Securities and Exchange Commission, specifically, KLA’s most recent Annual Report on Form 10-K and Quarterly Reports on Form 10-Q.  These documents contain important factors that could cause the actual results to differ materially from those contained in projections and other forward-looking statements including, among others, volatility and cyclicality in the semiconductor equipment industry and other industries in which KLA and its subsidiaries operate, potential fluctuations in operating results and stock price, international trade and economic conditions, the ability to compete successfully worldwide, management of technological change and customer requirements, fluctuations in product mix within and among divisions, the timing and strength of product and service offerings by KLA and its subsidiaries and its and their competitors, intellectual property obsolescence and infringement, and factors associated with key employees, key suppliers, acquisitions, and litigation. Additional factors impacting the business of KLA and its subsidiaries include integration between KLA and its acquired companies, ability to achieve synergies and other benefits of acquisitions in the timeframe anticipated, if at all.

KLA and its subsidiaries assume no obligation to update the information in this website (including press releases, webcasts, presentations, posts and other places) to reflect new information, future events or otherwise, except as required by law.


This site is provided by KLA (or its subsidiaries) on an "as is" basis. None of KLA and its subsidiaries make any representations or warranties of any kind, express or implied, as to the operation of the site, or the accuracy or completeness of the information, content, materials, pricing, services, or products included on this site. Product specifications and prices are subject to change without notice, and products may be discontinued without notice. None of KLA and its subsidiaries will be liable for any damages of any kind arising from the use of this site, or the material that is provided on this site, including but not limited to direct, indirect, special, incidental, punitive, or consequential damages.